Role of layer thickness on the damage mechanism in the LPBFed copper alloy.

Parts with interior voids created by the LPBF process are known to have the potential to cause fracture when subjected to mechanical loading. In this research, the key process parameters such as laser thickness (LT), scanning speed (SS), and laser power (LP) were taken into consideration to avoid the void formations which was the major reason for affecting the structural integrity. So, void formations (V), ultimate tensile strength (UTS) and reduced modulus (RM) were considered as the response parameters in this study. The entropy-associated weighted aggregated sum product assessment (WASPAS) approach was implemented to examine the favorable conditions which substantiated that the LT is the most influential parameter in nucleation of voids. The verification experiments prove that the void formation was reduced by 98.6% and the UTS and RM were enhanced by 52.17 and 31.7%. [ABSTRACT FROM AUTHOR]