Crack propagation simulation and overload fatigue life prediction via enhanced physics-informed neural networks.

• The enhanced PINNs specifically for solving crack problems are proposed. • An automatic crack growth simulation method is developed based on PINNs. • The algorithm based on PINNs for fatigue life considering overload is developed. • The stress intensity factors are accurately calculated based on enhanced PINNs. • The mixed-mode crack paths and overload fatigue life are accurately predicted. The fatigue crack growth simulation and life prediction of structures are implemented in this paper based on the physics-informed neural networks (PINNs). Firstly, the enhanced PINNs are proposed by introducing the crack tip asymptotic displacement fields, so that the crack tip stress intensity factors can be calculated accurately even when the number of collocation points is small and the distribution grid is regular. The enhanced PINNs essentially transform the solution of elastic body containing crack into the optimization of minimizing the constructed loss functions, and can invert the fracture parameters. Then, an automatic crack propagation simulation method is developed based on the enhanced PINNs. The network architecture and the overall node distribution can be unchanged during the crack propagation process, and only new crack surfaces need to be processed and corresponding loss functions need to be modified. Because the nodal refinement around crack-tip is not required, this simulation method is convenient and can accurately predict the mixed-mode crack propagation path. Finally, the fatigue crack growth life algorithm considering overload is developed, where the effect of each overload can be captured by the cycle-by-cycle method. Based on this algorithm, the retardation behavior can be characterized and the fatigue life of structure under the load spectrum with periodic overloads can be accurately predicted. The sufficient examples are given to verify the feasibility and accuracy of the method proposed in this paper. [ABSTRACT FROM AUTHOR]