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A novel multi-damage localization method for polymers and composites based on electromechanical impedance.
- Source :
-
Mechanical Systems & Signal Processing . Jul2024, Vol. 216, pN.PAG-N.PAG. 1p. - Publication Year :
- 2024
-
Abstract
- The electromechanical impedance (EMI) method has shown its damage detection capability for lightweight structures due to its damage sensitivity. In this paper, a new technique based on the uniform sensor network for multiple damage localization was proposed. The EMI-based damage indices were obtained from several piezoelectric transducers and fused for multiple-damage localization for the first time in literature. In the proposed approach, the sensor sub-network selection employs the vertices of a triangle based on the calculated sensing region radius. The method employs sub-networks to allow multiple damage sites localization without prior information about the number of damage sites to be found. These sub-networks approaches were applied to detect and localize the two and three damaged sites simultaneously. The glass fiber reinforced polymer (GFRP) and 3D-printed acrylonitrile butadiene styrene (ABS) plates were used for the investigation, with surface-bonded piezoelectric transducers (PZTs). Magnets were used to simulate multiple-damage positions, and drilled holes were used as more realistic multiple-damage. In the investigated cases the EMI data displays damage-sensitive peaks in a frequency range of 1 kHz to 200 kHz. The results show successfully the detection and localization of multiple-damage sites in additively manufactured (AM) polymer and fiber-reinforced composite plates. It was observed that the damage localization error increases significantly with the new damage introduced in the structures. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 08883270
- Volume :
- 216
- Database :
- Academic Search Index
- Journal :
- Mechanical Systems & Signal Processing
- Publication Type :
- Academic Journal
- Accession number :
- 177392653
- Full Text :
- https://doi.org/10.1016/j.ymssp.2024.111508