Mechanic performance of phosphoric acid-based geopolymer cured in an open environment.

Phosphoric acid-based geopolymer (PGEO) belongs to acidic material and has many applications in environmental disposal. The curing method has an important impact on the mechanic performance of geopolymers, the existing research concerning PGEO synthesized from fly ash (FA) and phosphoric acid (PA) are performed on the specimens cured at sealed environment, but no related research on the PGEO cured at an open environment is found. Therefore, to investigate the mechanic performance, pH and of PGEO cured in an open environment, the unconfined compressive strength tests were conducted on PGEO specimens cured in an open environment, and its mechanism was investigated using Scanning Electron Microscope, X-Ray diffraction, and Fourier transform infrared reflection (FTIR) tests. Moreover, the thermogravimetric was measured using the thermogravimetric tests. The results showed that in the scope of this study, the compressive strength of the PGEO decreased with the PA concentration and the liquid–solid ratio (L/S) increasing. When the L/S was a fixed value, as the curing time increased, an obvious strength loss was observed for the PGEO with the content of 40 and 50%, but the compressive strength increased first and then, reduced for the PGEO with the content of 40 and 50%, a maximum strength was obtained at 60 days of curing. The open curing for the PGEO is not conducive to the later growth of compressive strength. As the PA concentration and L/S increased, the pH descended. As the curing time lengthened, the pH first raised and then droped, the maximum pH was obtained at 60 days. Furthermore, the compressive strength increased with the pH with a good correlation. The microscopic analysis showed that the crystalline compounds AlSiP3, Ca2P2O7(H2O)2, molecular sieve SAPO-20 (Al0.47Si0.13P0.4)O2, AlPO4-5 (AlPO4), CaHPO4, and AlPO4 in PGEO were detected. Overall, the open curing environment is not conducive to PGEO, and sealed curing should be used in engineering applications. [ABSTRACT FROM AUTHOR]