A numerical investigation on the influence of full vs perimeter arrays on the mechanical reliability of electronic assemblies under vibration.

Purpose: This paper aims to compare and evaluate the influence of package designs and characteristics on the mechanical reliability of electronic assemblies when subjected to harmonic vibrations. Design/methodology/approach: Using finite element analysis (FEA), the effect of package design-related parameters, including the interconnect array configuration, i.e. full vs perimeter, and package size, on solder mechanical stresses are fully addressed. Findings: The results of FEA simulations revealed that the number of solder rows or columns available in the array, could significantly affect solder stresses. In addition, smaller packages result in lower solder stresses and differing distributions. Originality/value: In literature, there are no papers that discuss the effect of solder array layout on electronic packages vibration reliability. In addition, general rules for designing electronic assemblies subjected to harmonic vibration loadings are proposed in this paper. [ABSTRACT FROM AUTHOR]