Research on the Reliability of Interconnected Solder Joints of Copper Pillars under Random Vibration.

MLA

Yu, Shifeng, et al. “Research on the Reliability of Interconnected Solder Joints of Copper Pillars under Random Vibration.” Journal of Electronic Testing, vol. 40, no. 1, Feb. 2024, pp. 107–16. EBSCOhost, https://doi.org/10.1007/s10836-024-06101-1.

APA

Yu, S., Dai, J., & Li, J. (2024). Research on the Reliability of Interconnected Solder Joints of Copper Pillars under Random Vibration. Journal of Electronic Testing, 40(1), 107–116. https://doi.org/10.1007/s10836-024-06101-1

Chicago

Yu, Shifeng, Junjie Dai, and Junhui Li. 2024. “Research on the Reliability of Interconnected Solder Joints of Copper Pillars under Random Vibration.” Journal of Electronic Testing 40 (1): 107–16. doi:10.1007/s10836-024-06101-1.