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Fabrication of robust superhydrophobic surface on TC4 alloy by wire electrical discharge machining.
- Source :
-
Journal of Alloys & Compounds . Jun2024, Vol. 988, pN.PAG-N.PAG. 1p. - Publication Year :
- 2024
-
Abstract
- Superhydrophobic metal surfaces have significant applications in various areas such as surface self-cleaning, resistance reduction, anti-corrosion, etc. However, inexpensive preparation methods for superhydrophobic surfaces with a good mechanical stability are still to be developed. In this study, microarray structures on TC4 alloy were readily fabricated using a wire electrical discharge machining technology. Following the treatment with a fluorinating reagent, the microarray surface exhibited excellent superhydrophobic properties, where the largest contact angle and the smallest sliding angle reached 159° and 3°, respectively. Influences of the dimensions of microarray structure on the TC4 alloy surface wettability were also investigated in this study. Experiments show that this superhydrophobic surface possesses favorable self-cleaning, good mechanical stability, and promising anti-corrosion properties. In addition, by controlling the dimensions of the microstructure a superhydrophobic surface with a gradient wettability was also fabricated, which exhibits the property of doing nondestructive transportation of liquids. • Superhydrophobic surface on TC4 alloy surface is realized by using low-cost wire electrical discharge machining. • The influences of microarray structure size on surface wettability are systematically analyzed. • The prepared superhydrophobic surface has excellent mechanical stability, corrosion resistance and self-cleaning effect. • The gradient superhydrophobic surface is achieved by adjusting the dimension of the microarray structures. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 09258388
- Volume :
- 988
- Database :
- Academic Search Index
- Journal :
- Journal of Alloys & Compounds
- Publication Type :
- Academic Journal
- Accession number :
- 176438251
- Full Text :
- https://doi.org/10.1016/j.jallcom.2024.174329