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Facile synthesis of functionalized boron nitride nanosheets for photo-cured 3D printing of high thermal conductive composites.

Authors :
Yaxing Zhao
Lulu Ban
Chen Chen
Binjie Yang
Shuai Zhang
Chao Chen
Zhengwei Cui
Ren Liu
Xinxin Sang
Source :
Polymer Composites. 3/10/2024, Vol. 45 Issue 4, p3156-3168. 13p.
Publication Year :
2024

Abstract

Addressing the concern of heat accumulation in electronic devices, considerable research efforts have been dedicated to develop composites that are thermally conductive yet electrically insulative. Incorporating hexagonal boron nitride (h-BN) as fillers shows promise in enhancing the thermal conductivity of polymer composites. However, notable challenges arise from difficulties in achieving well dispersion and establishing efficient three-dimensional thermal conductive networks. This work demonstrated an efficient photocurable direct ink writing (DIW) printing method to fabricate functional h-BN nanosheets (A-BNNS)/epoxy acrylate (EA) resin-based thermal conductive composites (A-BNNS/EA). Apple polyphenol-assisted ball milling was employed to fabricate functionalized BN nanosheets (A-BNNS). Subsequently, A-BNNS/EA inks were 3D printed using DIW to create thermally conductive composites, which were then UV-cured. The composite containing 55 wt% A-BNNS demonstrated an impressive thermal conductivity (TC) of 3.44 W/(m K). The utilization of 3D printing technology enables an onion-like dispersion of A-BNNS within the polymer matrix, effectively constructing three-dimensional thermal conductive networks. This contribution significantly enhances the overall thermal conductivity. Highlights • The functional BNNS (A-BNNS) was achieved by apple polyphenol-assisted ball milling. • The utilization of photocurable 3D printing technology for producing high thermal conductivity materials are efficient. • A-BNNS exhibited an onion-like distribution and effectively constructed a 3D thermal conductive network within the polymer matrix • The composites demonstrate excellent thermal conductivity and favorable heat dissipation property. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
02728397
Volume :
45
Issue :
4
Database :
Academic Search Index
Journal :
Polymer Composites
Publication Type :
Academic Journal
Accession number :
176418934
Full Text :
https://doi.org/10.1002/pc.27980