Compressible thermal interface materials with high through-plane thermal conductivity from vertically oriented carbon fibers.

MLA

Fu, Liqin, et al. “Compressible Thermal Interface Materials with High Through-Plane Thermal Conductivity from Vertically Oriented Carbon Fibers.” Journal of Alloys & Compounds, vol. 987, June 2024, p. N.PAG. EBSCOhost, https://doi.org/10.1016/j.jallcom.2024.174200.

APA

Fu, L., Kong, N., Huang, M., Tian, Y., Yan, Y., Wen, B., Ye, C., Huang, D., & Han, F. (2024). Compressible thermal interface materials with high through-plane thermal conductivity from vertically oriented carbon fibers. Journal of Alloys & Compounds, 987, N.PAG. https://doi.org/10.1016/j.jallcom.2024.174200

Chicago

Fu, Liqin, Nizao Kong, Min Huang, Yexin Tian, Yuanwei Yan, Bingjie Wen, Chong Ye, Dong Huang, and Fei Han. 2024. “Compressible Thermal Interface Materials with High Through-Plane Thermal Conductivity from Vertically Oriented Carbon Fibers.” Journal of Alloys & Compounds 987 (June): N.PAG. doi:10.1016/j.jallcom.2024.174200.