Flexible phase change materials based on hexagonal boron nitride (hBN) surface modification and styrene-butadiene-styrene (SBS)/low-density polyethylene (LDPE) crosslinking for battery thermal management applications.

[Display omitted] • Surface modification of hBN was carried out, making hBN more compatible with matrix. • FPCMs with excellent overall performance have been prepared. • Induced SBS/LDPE cross-linking improves the high-temperature resistance of FPCMs. • FPCMs show much better battery thermal management performance. In battery thermal management (BTM), flexible phase change materials (FPCMs) emerge as highly promising substances, owing to their simple installment and low contact thermal resistance. However, FPCMs based on high thermal conductivity fillers and polymers always suffer from the enduring challenges of poor high-temperature resistance and poor filler-matrix compatibility. To solve these problems, a novel strategy is reported in this work, wherein FPCMs with excellent filler-matrix compatibility and satisfactory high-temperature resistance are synthesized by two steps: functionalizing the hexagonal boron nitride (hBN) surface and inducing the inter crosslinking between Styrene-Butadiene-Styrene(SBS) and Low-density polyethylene(LDPE). Vinyltrimethoxysilane (VTMS) molecules were introduced on the surface of raw hBN by hydroxylation and silanization surface modification to improve the compatibility of hBN with the matrix. Concluding from the results, the addition of 6.7 wt% LDPE doubled the high-temperature resistance of FPCMs, enabling them to maintain their structural integrity even at 200 °C for 1 h. The prepared FPCMs also exhibited higher thermal conductivity (increased by 20.5 %), low leakage rate (<0.6 wt% after 70 heating–cooling cycles), high enthalpy (122 J g−1), and strong adhesion (>0.1 MPa), etc. In terms of BTM performance, the FPCMs-based passive cooling BTM presents remarkable temperature control capabilities (maximum temperature reduction by 16.3 ℃) and uniform temperature performance (maximum temperature difference < 2.5 ℃). Collectively, this work will provide a promising approach for the fabrication of high-performance FPCMs in BTM and other thermal management applications for electronic devices. [ABSTRACT FROM AUTHOR]