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Electrochemical Ultrathin Metal‐Atomic Layer Deposition for Silica Microenvironment‐Assisted Cu‐Based Catalysis (Adv. Funct. Mater. 12/2024).

Authors :
Jeevanandham, Sampathkumar
Maji, Ankur
Acharya, Anubhab
Kumari, Nitee
Gu, Byeong Su
Yoon, Youngkwan
Choi, Hee Cheul
Kumar, Amit
Lee, In Su
Source :
Advanced Functional Materials. 3/18/2024, Vol. 34 Issue 12, p1-1. 1p.
Publication Year :
2024

Abstract

In an article published in Advanced Functional Materials, researchers Amit Kumar, In Su Lee, and their colleagues discuss their findings on electrochemical ultrathin metal-atomic layer deposition for silica microenvironment-assisted Cu-based catalysis. They demonstrate the formation of a sandwiched structure consisting of a 2D-Cu nanolayer grown electrochemically on a carbon paper inside a porous bilayer silica template. This structure, with its extended and intimate 2D-2D silica-Cu interface, acts as a catalyst for the selective hydrogenation of alkynes to alkenes. [Extracted from the article]

Subjects

Subjects :
*CATALYSIS
*SILICA
*COPPER

Details

Language :
English
ISSN :
1616301X
Volume :
34
Issue :
12
Database :
Academic Search Index
Journal :
Advanced Functional Materials
Publication Type :
Academic Journal
Accession number :
176146382
Full Text :
https://doi.org/10.1002/adfm.202470065