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Electrochemical Ultrathin Metal‐Atomic Layer Deposition for Silica Microenvironment‐Assisted Cu‐Based Catalysis (Adv. Funct. Mater. 12/2024).
- Source :
-
Advanced Functional Materials . 3/18/2024, Vol. 34 Issue 12, p1-1. 1p. - Publication Year :
- 2024
-
Abstract
- In an article published in Advanced Functional Materials, researchers Amit Kumar, In Su Lee, and their colleagues discuss their findings on electrochemical ultrathin metal-atomic layer deposition for silica microenvironment-assisted Cu-based catalysis. They demonstrate the formation of a sandwiched structure consisting of a 2D-Cu nanolayer grown electrochemically on a carbon paper inside a porous bilayer silica template. This structure, with its extended and intimate 2D-2D silica-Cu interface, acts as a catalyst for the selective hydrogenation of alkynes to alkenes. [Extracted from the article]
- Subjects :
- *CATALYSIS
*SILICA
*COPPER
Subjects
Details
- Language :
- English
- ISSN :
- 1616301X
- Volume :
- 34
- Issue :
- 12
- Database :
- Academic Search Index
- Journal :
- Advanced Functional Materials
- Publication Type :
- Academic Journal
- Accession number :
- 176146382
- Full Text :
- https://doi.org/10.1002/adfm.202470065