Tailoring the microstructure, mechanical properties, and electrical conductivity of Cu–0.7Mg alloy via Ca addition, heat treatment, and severe plastic deformation.

The effects of 0.1 wt.% Ca addition, heat treatment, and SPD processing using the MaxStrain module of the Gleeble thermomechanical simulator on the microstructure, mechanical properties, and electrical conductivity of Cu–0.7Mg (wt.%) alloy were investigated in this work. The binary alloy exhibited a single-phase microstructure, whereas the ternary alloy featured uniform dispersion of Cu5Ca intermetallic particles inside the grains as well as on grain boundaries. These particles resulted in an average hardness that was 33% higher than that of the binary alloy, as well as 13% higher yield strength and 13% higher ultimate tensile strength. The heat treatment process not only enhanced the yield strength and ultimate tensile strength of the samples, but also resulted in the partial spheroidization of Cu5Ca particles within the microstructure of the ternary alloy, resulting in its improved ductility. Following MaxStrain processing, ternary samples exhibited a smaller grain size and a higher fraction of high-angle grain boundaries than binary samples, which was attributed to the vital role of Cu5Ca intermetallic particles in hindering the dislocation motion during deformation. MaxStrain-processed samples exhibited marginally lower electrical conductivities than their initial counterparts; yet, all MaxStrain-processed samples satisfied the electrical conductivity threshold for classification as HSHC Cu alloys. [ABSTRACT FROM AUTHOR]