Electrical characterization and performance analysis of coaxial through-glass vias.

In this paper, we have proposed the precise model of coaxial TGVs (CTGVs) which consists of ground-signal signal-ground (GSSG) TGVs. An equivalent electrical model of CTGVs is established and the partial element equivalent circuit (PEEC) technique is used to extract the frequency-dependent impedance parameters. In CTGVs, multi-walled carbon nanotubes (MWCNT) and copper is used as filler material in inner and outer layer. Resistance and inductance of CTGVs is calculated using the PEEC technique for different filler materials. The insertion loss (S21) of CTGVs is determined using the HFSS simulations and is compared analytically in differential mode configurations. S21 is calculated for various geometrical parameters of MWCNT-based CTGVs such as diameter of TGV, pitch between CTGV pair, as well as material properties such as permittivity of SiO2 and benzocyclobutene (BCB) polymers. It is established that MWCNT based CTGV shows improved insertion loss because the conductivity of MWCNT is higher in comparison to copper. [ABSTRACT FROM AUTHOR]