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Microstructure and mechanical property of thick Cu/AlN joints formed at low temperature.
- Source :
-
Journal of the American Ceramic Society . Jan2024, Vol. 107 Issue 1, p67-75. 9p. - Publication Year :
- 2024
-
Abstract
- The bonding of thick Cu and AlN is necessary in power modules with the development of high‐frequency communication technology. In this work, 2 mm‐thick Cu was successfully bonded with AlN by using Sn9Zn solder with the assistance of ultrasonication at 230°C. Results showed that an AlN/Sn9Zn/Cu joint without crack was manufactured with a cooling rate of 7°C/min. Nonreactive wetting was realized between AlN and Sn9Zn, forming an amorphous transition layer. CuZn2 and CuZn were formed at the Sn9Zn/Cu interface. A joint with the highest bonding strength of 30.07 MPa was obtained, in which the AlN/Sn9Zn interface was no longer the weakest location. This work provides a low‐temperature manufacturing method for thick Cu/AlN joints. [ABSTRACT FROM AUTHOR]
- Subjects :
- *COPPER
*LOW temperatures
*MICROSTRUCTURE
*TELECOMMUNICATION
*BOND strengths
Subjects
Details
- Language :
- English
- ISSN :
- 00027820
- Volume :
- 107
- Issue :
- 1
- Database :
- Academic Search Index
- Journal :
- Journal of the American Ceramic Society
- Publication Type :
- Academic Journal
- Accession number :
- 173469864
- Full Text :
- https://doi.org/10.1111/jace.19427