Cite
Effect of additives on microstructure and properties of the coarsened layer of very low profile (HVLP) copper foil.
MLA
Xiao, Yan, et al. “Effect of Additives on Microstructure and Properties of the Coarsened Layer of Very Low Profile (HVLP) Copper Foil.” Journal of Applied Electrochemistry, vol. 53, no. 12, Dec. 2023, pp. 2331–46. EBSCOhost, https://doi.org/10.1007/s10800-023-01930-y.
APA
Xiao, Y., Sun, W., Bai, Z., Liu, E., Du, L., Cai, H., Wang, L., Liu, J., Jia, Y., & Zhang, J. (2023). Effect of additives on microstructure and properties of the coarsened layer of very low profile (HVLP) copper foil. Journal of Applied Electrochemistry, 53(12), 2331–2346. https://doi.org/10.1007/s10800-023-01930-y
Chicago
Xiao, Yan, Wan-chang Sun, Zhong-bo Bai, Er-yong Liu, Liang-liang Du, Hui Cai, Li-ping Wang, Jing-pei Liu, Ya-peng Jia, and Jie Zhang. 2023. “Effect of Additives on Microstructure and Properties of the Coarsened Layer of Very Low Profile (HVLP) Copper Foil.” Journal of Applied Electrochemistry 53 (12): 2331–46. doi:10.1007/s10800-023-01930-y.