Back to Search Start Over

Gelatin Biogel–Liquid Metal Composite Transient Circuits for Recyclable Flexible Electronics.

Authors :
Song, Huafeng
Wang, Haifei
Gan, Tiansheng
Shi, Shiyang
Zhou, Xuechang
Zhang, Yaokang
Handschuh‐Wang, Stephan
Source :
Advanced Materials Technologies. Jul2024, Vol. 9 Issue 14, p1-8. 8p.
Publication Year :
2024

Abstract

Transient electronics with degradability or dissolvability on demand possess remarkable characteristics for wearable, bioelectronic, and implanted electronic devices. While synthetic materials have made significant progress in degradability and stretchability, they suffer from intrinsic limitations, including low degradation rates, poor mechanical compliance, and high production cost, which restrict the growth of transient electronic devices. Herein, a versatile fabrication strategy is presented for transient electronics that combine a resilient biopolymer substrate (gelatin biogels) with liquid metal (Galinstan). The circuits made from gelatin biogel‐based and liquid metal are mechanically resilient and durable, exhibiting good compliance with irregular and deformable surfaces, and thus can withstand long‐term exposure to dynamic deformation (about 60 000 cycles at a strain of 50%). More importantly, gelatin biogels are naturally derived and endowed with thermally reversible gelling, which enables on‐demand rapid dissolution and recycling of the materials. As a proof‐of‐concept, transient circuit‐based capacitive sensors, which can be degraded within 20 s, are fabricated for monitoring finger touching, morse code generation, and electrical touchpad. Such a strategy provides a guideline for designing transient electronics with a combination of biopolymer gels and liquid metal, and this approach is anticipated to find applications in human–machine interfaces and wearable devices. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
2365709X
Volume :
9
Issue :
14
Database :
Academic Search Index
Journal :
Advanced Materials Technologies
Publication Type :
Academic Journal
Accession number :
178558392
Full Text :
https://doi.org/10.1002/admt.202301483