High throughput, spatially resolved thermal properties measurement using attachable and reusable 3ω sensors.

MLA

Chalise, Divya, et al. “High Throughput, Spatially Resolved Thermal Properties Measurement Using Attachable and Reusable 3ω Sensors.” Review of Scientific Instruments, vol. 94, no. 9, Sept. 2023, pp. 1–9. EBSCOhost, https://doi.org/10.1063/5.0151160.

APA

Chalise, D., Tee, R., Zeng, Y., Kaur, S., Pokharna, H., & Prasher, R. S. (2023). High throughput, spatially resolved thermal properties measurement using attachable and reusable 3ω sensors. Review of Scientific Instruments, 94(9), 1–9. https://doi.org/10.1063/5.0151160

Chicago

Chalise, Divya, Richard Tee, Yuqiang Zeng, Sumanjeet Kaur, Himanshu Pokharna, and Ravi S. Prasher. 2023. “High Throughput, Spatially Resolved Thermal Properties Measurement Using Attachable and Reusable 3ω Sensors.” Review of Scientific Instruments 94 (9): 1–9. doi:10.1063/5.0151160.