等离子体改性聚酰亚胺热老化的分子模拟.

The thermal aging process of polyimide is simulated by reactive molecular dynamics method to simulate the property changes of plasma-modified polyimide materials after thermal cracking. By studying the generation of gas during aging, it was found that as the temperature increases, the interaction forces between molecular chains weaken, resulting in a decrease in the denseness of the material, a decrease in the modulus of elasticity, and a decrease in the ability of the material to resist external stress. At the same time, the relative dielectric constant of the polyimide material increases due to the increase of temperature, and the insulation property of the material decreases and the breakdown strength is also weakened. [ABSTRACT FROM AUTHOR]