A review on immersion cooling of electronic systems.

The efficient cooling of high-density electronic systems is challenged by the increasing number of transistors in the processor chip. Conventional air cooling and indirect liquid cooling have reached their limits, and new cooling methods such as immersion cooling are being sought. There is disagreement among researchers on the evaluation of the exact heat transfer mechanism in immersion cooling, but the improvement in heat transfer coefficient is clear in the literature. Unlike single-phase immersion cooling systems, double-phased systems are restricted by coolant choices because, in addition to good dielectric strength, they also should have a lower boiling temperature which matches the safe operating temperature of electronic systems. The two-phase immersion cooling eliminates the requirement of active cooling components such as interface materials, heat sinks, and fans. The use of nanoparticles and nanofluids as heat transfer enhancement methods has been widely studied in the past. This review explores the possibility of using dielectric nanofluids for double-phase immersion cooling applications. The nanoparticle being considered for double-phase immersion cooling is diamond nanoparticles because of their high dielectric strength. The thermal conductivity measurement of nanofluids has been studied in detail by past researchers, of which prominent ones are discussed in this paper. Ease of availability is used as a criterion for identifying dielectric fluids that are compatible with double-phase immersion cooling. Various methods for improving the heat transfer rate in pool boiling are reviewed, with the majority of them focusing on the creation of additional nucleation sites and the acceleration of bubble departure. [ABSTRACT FROM AUTHOR]