Flexible printed electronics and their applications in food quality monitoring and intelligent food packaging: Recent advances.

MLA

Yue, Chongze, et al. “Flexible Printed Electronics and Their Applications in Food Quality Monitoring and Intelligent Food Packaging: Recent Advances.” Food Control, vol. 154, Dec. 2023, p. N.PAG. EBSCOhost, https://doi.org/10.1016/j.foodcont.2023.109983.

APA

Yue, C., Wang, J., Wang, Z., Kong, B., & Wang, G. (2023). Flexible printed electronics and their applications in food quality monitoring and intelligent food packaging: Recent advances. Food Control, 154, N.PAG. https://doi.org/10.1016/j.foodcont.2023.109983

Chicago

Yue, Chongze, Jingyi Wang, Zhiqiang Wang, Boyang Kong, and Guiying Wang. 2023. “Flexible Printed Electronics and Their Applications in Food Quality Monitoring and Intelligent Food Packaging: Recent Advances.” Food Control 154 (December): N.PAG. doi:10.1016/j.foodcont.2023.109983.