孔洞对 FeCrNiCoCu 高熵合金拉伸性能 影响的分子动力学研究.

Void is a common defect in the preparation of FeCrNiCoCu high - entropy alloy. Thus, this paper employs molecular dynamic simulation to build FeCrNiCoCu models with void for uniaxial tension simulation, and explores the effect of the voids location, void radius and deformation temperature on the mechanical properties. It is found that the void in the crystal with the Z -axis orientation of [111] and at the grain-boundary(GB) will seriously reduce the yield strain and yield stress, but have little effect on the Young's modulus of the model. With the increase of the void radius at the grain boundary, in the elastic stage, the increase of the void radius increases the area of stress concentration, which is conducive to dislocation nucleation, and the mechanical proper- ties of the model decrease accordingly. In the plastic deformation stage, with the increase of the void radius, the initial dislocations tend to expand to the crystal with the Z axis orientation of [001]. The model maintains good mechanical properties at medium and low temperatures; at high temperature, the mechanical properties decrease significantly. In the high temperature plastic deformation stage, the total length of dislocation in the model is low, and the average flow stress is also low. [ABSTRACT FROM AUTHOR]