A review on the thermal conductivity of deep eutectic solvents.

Deep eutectic solvents may develop a pivotal role in future technologies considering sustainability and safety as pivotal aspects for chemistry developments. The possible application of these fluids for heat transfer operations is of great relevance for which the knowledge of thermal properties such as thermal conductivity is required as well as inferring structure–property relationships which allow reverse design of the fluids according to the technological requirements. Considering the technological relevance of this property, the available literature on the thermal conductivity for deep eutectic solvents is critically discussed showing strengths and weaknesses. The analysis of the state-of-the-art shows the future needs in this research field considering the application of these solvents for thermal-related technologies. The review indicates the scarcity of reliable experimental data and the need of predictive methods, which could be used for process design and solvent screening purposes. Likewise, considering the relevance of developing predictive methods for in silico design of these fluids according to industrial needs, the available predictive theoretical approaches are analysed showing their reliability as well as future needs. Finally, considering the need of developing suitable and reliable structure–property relationship, the molecular level basis of thermal conductivity in deep eutectic solvents is discussed, showing the role of hydrogen bonding and the effects rising from the involved hydrogen bond donors and acceptors as well as the eutectic compositions. This work reports the first literature review and analysis on thermal conductivity for deep eutectic solvents considering an experimental and theoretical approach as well as providing support for the molecular basis of this technologically relevant property, thus contributing to the development of environmentally friendly materials for thermal-related technologies. [ABSTRACT FROM AUTHOR]