Experimental and numerical study heat transfer performance for printed circuit board.

Electronic circuit cooling has become a critical consideration in the development of electronics. Overheating might result in hardware malfunctions or damage. Air-cooling is an efficient invention to the Printed Circuit Board (PCB) cooling, and the real motherboard ASUS X399-A is inspected by simulation experimentally and numerically. Finite volume method CFD procedure is employed to pattern the forced convection laminar air-cooling flow in a three-dimensional motherboard. Experiments are performed on the motherboard to simulate the PCB in both horizontal and vertical orientations with a processor full load heat power of 130 W. The results proved that there is an enhancement in heat transfer in the horizontal position from the vertical position in the same working conditions. [ABSTRACT FROM AUTHOR]