Investigation of the Characteristics of a Graphene-Based Thermal Interface for Cooling Integrated Microcircuits.

A study was made of a thermal interface based on a two-dimensional allotropic modification of carbon (graphene), presented in the form of a powder, for cooling integrated circuits. Such physical properties of the thermal interface as thermal conductivity, heat capacity, thermal diffusivity, and density are determined by the empirical method. The process of heat transfer in the most efficient thermal interface sample during the operation of integrated circuits in the ANSYS engineering analysis system is presented. The prospects of using pressed graphene powder as a thermal interface in order to eliminate the use of a binder are described. The paper also makes a comparison with the most effective type of thermal interfaces currently in use. [ABSTRACT FROM AUTHOR]