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State-of-the-Art in Chiplets Horizontal Communications.
- Source :
-
Journal of Microelectronic & Electronic Packaging . 2023, Vol. 20 Issue 2, p43-64. 22p. - Publication Year :
- 2023
-
Abstract
- In this study, the recent advances and trends in chiplet lateral communications (bridges) will be investigated. Emphasis is placed on the definition, kinds, advantages and disadvantages, challenges (opportunities), and examples of chiplet horizontal communications. Some recommendations will also be provided. [ABSTRACT FROM AUTHOR]
- Subjects :
- *COMMUNICATION
*BRIDGES
*EMPHASIS (Linguistics)
*SEMANTICS
*INHOMOGENEOUS materials
Subjects
Details
- Language :
- English
- ISSN :
- 15514897
- Volume :
- 20
- Issue :
- 2
- Database :
- Academic Search Index
- Journal :
- Journal of Microelectronic & Electronic Packaging
- Publication Type :
- Academic Journal
- Accession number :
- 164653090
- Full Text :
- https://doi.org/10.4071/001c.81977