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State-of-the-Art in Chiplets Horizontal Communications.

Authors :
Lau, John H.
Source :
Journal of Microelectronic & Electronic Packaging. 2023, Vol. 20 Issue 2, p43-64. 22p.
Publication Year :
2023

Abstract

In this study, the recent advances and trends in chiplet lateral communications (bridges) will be investigated. Emphasis is placed on the definition, kinds, advantages and disadvantages, challenges (opportunities), and examples of chiplet horizontal communications. Some recommendations will also be provided. [ABSTRACT FROM AUTHOR]

Subjects

Subjects :
*COMMUNICATION
*BRIDGES
*EMPHASIS (Linguistics)
*SEMANTICS
*INHOMOGENEOUS materials

Details

Language :
English
ISSN :
15514897
Volume :
20
Issue :
2
Database :
Academic Search Index
Journal :
Journal of Microelectronic & Electronic Packaging
Publication Type :
Academic Journal
Accession number :
164653090
Full Text :
https://doi.org/10.4071/001c.81977
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