Study on the synergistic effect and mechanism of inhibitors benzotriazole and pyrazole on copper surface.

In the giant large-scale integrated circuits manufacturing process, chemical mechanical polishing (CMP) for Cu interconnection can lead to chemical corrosion on Cu surface if inhibitors are not added to the CMP slurry. This paper concentrated on the synergistic effect of benzotriazole (BTA) and pyrazole (PZ). Electrochemical tests and UV–Vis spectra showed that they were effective inhibitors. The adsorption mechanism was investigated by fitting the adsorption isotherm and using quantum chemical calculations. Finally, the synergistic effect of BTA and PZ was studied by electrochemical experiments and corrosion characterization. The outcomes demonstrated that the surface quality and inhibition effect of composite inhibitor (BTA/PZ) were better than that of single inhibitor. This result could be the consequence of changes in the density and structure of the passive film composed of Cu and inhibitors. [ABSTRACT FROM AUTHOR]