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FEA makes short work of optimization studies.
- Source :
-
Machine Design . 3/17/2005, Vol. 77 Issue 6, p118-120. 2p. 2 Color Photographs, 1 Diagram, 2 Graphs. - Publication Year :
- 2005
-
Abstract
- Focuses on the application of the FEA software 3G.author from PlassoTech Inc. in determining solder thickness that minimizes thermal resistance and mechanical stresses in a semiconductor. Significance of solder in the thermal resistance of the entire structure; Illustration of solder thickness versus resistance and stress; Results of the solder thickness optimization.
Details
- Language :
- English
- ISSN :
- 00249114
- Volume :
- 77
- Issue :
- 6
- Database :
- Academic Search Index
- Journal :
- Machine Design
- Publication Type :
- Periodical
- Accession number :
- 16437987