Preparation of 5N Micron Conductive Gold Spheres for Semiconductor Chips.

The preparation technology of micron spherical metal powder has become a common problem in the fields of chip, medical diagnosis, and 3D-printing. In this paper, micron spherical gold powder was prepared by hydrometallurgy process, and high-purity conductive gold ball was prepared by plasma spheroidizing method. The high-purity and highly dispersed gold powder was prepared with the self-made Au-99. 999% as raw material, hydrazine hydrate as reducing agent and PVP as diluent, and the reduction potential was controlled at 1 692 ~ 1 002 mV, 5N micron conductive gold spheres for semiconductor chips are obtained by gas flow crushing and plasma spheroidizing. At present, this method has realized industrialized production of 10 kg, preliminarily solved the problem that the conductive gold ball for domestic chip packaging was monopolized by other countries, and made an important contribution to improving China's chip R & D industry chain, especially the research and development of electronic grade gold raw materials. [ABSTRACT FROM AUTHOR]