Performance degradation and I–V model of TiO2-film-based resistive switching memory under proton irradiation.

The performance degradation of a TiO2-film-based RRAM (resistive random access memory) is investigated in a proton irradiation experiment with an energy of 25 MeV. The results reveal that the fabricated Au/TiO2 film/Ti devices exhibit typical I–V of bipolar resistive switching behavior under an irradiation of 1 × 1011 protons/cm2. The low-resistance state (LRS) resistance remains nearly constant, but the high-resistance state (HRS) resistance decreases with an increasing proton fluence. The value of the HRS resistance decreases by approximately one order of magnitude when the value of proton fluence reaches 1 × 1011 protons/cm2. Moreover, the SET voltage decreases with a decreasing proton fluence, while the RESET voltage remains almost constant. Material characterization via x-ray photoelectron spectroscopy demonstrates that the decrease in SET voltage and HRS resistance is mainly caused by radiation-induced oxygen vacancies and non-lattice oxygen. Based on the Voltage Threshold Adaptive Memristor model, a mathematical model of the I–V curve which demonstrates the variation in the RRAM resistance and voltage as a function of proton irradiation is constructed. The simulation results conformed to the experimental results under different proton fluences. Our results form a fundamental guide for the study of radiation performance degradation and radiation hardening of the RRAM with oxygen vacancy conducting filament. [ABSTRACT FROM AUTHOR]