Back to Search
Start Over
Heterogeneous Integration on 2.3D Hybrid Substrate Using Solder Joint and Underfill.
- Source :
-
Journal of Microelectronic & Electronic Packaging . 2022, Vol. 19 Issue 1, p8-17. 10p. - Publication Year :
- 2022
-
Abstract
- In this study, the heterogeneous integration of two chips on a 2.3D hybrid substrate using solder joint and underfill is investigated. Emphasis is placed on the materials, design, process, fabrication, and reliability of the package. Drop test and results of the package are also provided. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 15514897
- Volume :
- 19
- Issue :
- 1
- Database :
- Academic Search Index
- Journal :
- Journal of Microelectronic & Electronic Packaging
- Publication Type :
- Academic Journal
- Accession number :
- 163785242
- Full Text :
- https://doi.org/10.4071/imaps.1546248