Numerical Simulation on the Warpage of Reconstructed Wafer During Encapsulation Process.

MLA

Hu Zhen, et al. “Numerical Simulation on the Warpage of Reconstructed Wafer During Encapsulation Process.” Journal of Microelectronic & Electronic Packaging, vol. 19, no. 3, July 2022, pp. 89–94. EBSCOhost, https://doi.org/10.4071/imaps.1721531.

APA

Hu Zhen, Zhao Wei, Gu Xiao, Chen Dong, Chen Haijie, Xu Hong, & Kim Hwee Tan. (2022). Numerical Simulation on the Warpage of Reconstructed Wafer During Encapsulation Process. Journal of Microelectronic & Electronic Packaging, 19(3), 89–94. https://doi.org/10.4071/imaps.1721531

Chicago

Hu Zhen, Zhao Wei, Gu Xiao, Chen Dong, Chen Haijie, Xu Hong, and Kim Hwee Tan. 2022. “Numerical Simulation on the Warpage of Reconstructed Wafer During Encapsulation Process.” Journal of Microelectronic & Electronic Packaging 19 (3): 89–94. doi:10.4071/imaps.1721531.