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Ultrathin Li-rich Li-Cu alloy anode capped with lithiophilic LiC6 headspace enabling stable cyclic performance.

Authors :
Wang, Zihao
Deng, Qijiu
Song, Zhicui
Liu, Yuchi
Xing, Jianxiong
Wei, Chaohui
Wang, Yuehui
Li, Jingze
Source :
Journal of Colloid & Interface Science. Aug2023, Vol. 643, p205-213. 9p.
Publication Year :
2023

Abstract

[Display omitted] Li-rich dual-phase Li-Cu alloy is a promising candidate toward practical application of Li metal anode due to its in situ formed unique three-dimensional (3D) skeleton of electrochemical inert LiCu x solid-solution phase. Since a thin layer of metallic Li phase appears on the surface of as-prepared Li-Cu alloy, the LiCu x framework cannot regulate Li deposition efficiently in the first Li plating process. Herein, a lithiophilic LiC 6 headspace is capped on the upper surface of the Li-Cu alloy, which can not only offer free space to accommodate Li deposition and maintain dimensional stability of the anode, but also provide abundant lithiophilic sites and guide Li deposition effectively. This unique bilayer architecture is fabricated via a facile thermal infiltration method, where the Li-Cu alloy layer with an ultrathin thickness around 40 μm occupies the bottom of a carbon paper (CP) sheet, and the upper part of this 3D porous framework is reserved as the headspace for Li storage. Notably, the molten Li can quickly convert these carbon fibers of the CP into lithiophilic LiC 6 fibers while the CP is touched with the liquid Li. The synergetic effect between the LiC 6 fibers framework and LiCu x nanowires scaffold can ensure a uniform local electric field and stable Li metal deposition during cycling. As a consequence, the CP capped ultrathin Li-Cu alloy anode demonstrates excellent cycling stability and rate capability. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
00219797
Volume :
643
Database :
Academic Search Index
Journal :
Journal of Colloid & Interface Science
Publication Type :
Academic Journal
Accession number :
163587033
Full Text :
https://doi.org/10.1016/j.jcis.2023.03.191