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Conductive polymer composites using 3D printing for electronic devices: A review.

Authors :
Khalid, Nisa Naima
Radzuan, Nabilah Afiqah Mohd
Sulong, Abu Bakar
Foudzi, Farhana Mohd
Source :
AIP Conference Proceedings. 20223, Vol. 2544 Issue 1, p1-5. 5p.
Publication Year :
2023

Abstract

The use of polyamide as a high-performance composite material with low cost and easy handling has expanded its application in industry. A few decades ago, many studies were done to expand the application of electronics in everyday life. However, the growing use of electronic equipment has dangers such as non-uniform temperature distribution and high-performance heat flux resulting in reduced life expectancy and reliability of electronic devices. Thus, the use of polyamide in electronic devices is seen to be cost effective and environmentally friendly. It also offers performance advantages such as abrasion and heat resistant drive in materials suitable for electronic use. The purpose of this study is to examine the influence of polyamide reinforced carbon fiber as a conductive material of composite polymers on mechanical, thermal and electrical properties for electronic devices. Tests on the electrical, thermal, and mechanical properties of polyamide reinforced carbon fibers through 3D printing methods in the manufacture of additives have been studied for the adaptation of composite polymer conductive materials to electronic devices. It found that the use of polyamide as an amplifier has increased tensile strength and modulus to (70.9 MPa and 3261 MPa) respectively. In addition, the thermal properties of polyamide also produce polymer shrinkage of 13800 µm/m. The electrical properties have high strength with decreasing cooling rate. This study provides a promising approach the use of polyamide reinforced carbon fiber has improved the suitability of the material to be used in the manufacture of additives on electronic devices. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
0094243X
Volume :
2544
Issue :
1
Database :
Academic Search Index
Journal :
AIP Conference Proceedings
Publication Type :
Conference
Accession number :
163331922
Full Text :
https://doi.org/10.1063/5.0116323