纳秒激光诱导等离子体辅助烧蚀的玻璃表面金属化图案电路研究.

Laser Induced Plasma Assisted Ablation (LIPAA) has the advantages of economy, environmental friendliness, and high efficiency in the preparation of glass surface metallization. The feasibility of realizing metallized pattern circuit by using LIPAA process on glass substrate with metal copper as sacrificial target under nanosecond laser is studied. Therefore, firstly, the conductivity of metallized pattern circuit on glass substrate prepared by progressive scanning LIPAA is discussed in detail. In view of the disadvantage of the reduction of its conductivity caused by oxidation, the hydrogen reduction was further used to optimize its post treatment, and the circuit performance was analyzed by combining Scanning Electron Microscopy(SEM) and Energy Dispersive Spectroscopy (EDS), revealing the morphology characteristics and the change rule of resistivity of the surface of the glass metallized pattern circuit prepared by nanosecond laser LIPAA method. The results show that the metal layer on the glass surface can be directly ablated by the laser patterning removal process, and the fine patterned circuit can be prepared on the glass surface. At the same time, the chemical hydrogen reduction method can overcome the disadvantage that the metal layer oxidation seriously affects the circuit resistivity. The average resistivity after chemical hydrogen reduction is only 8.18 X 10-7Ω·m, which greatly improves the conductivity of the patterned circuit on the glass surface, shows broad application prospects. [ABSTRACT FROM AUTHOR]