Advances in Printing and Electronics: From Engagement to Commitment.

MLA

Martins, P., et al. “Advances in Printing and Electronics: From Engagement to Commitment.” Advanced Functional Materials, vol. 33, no. 16, Apr. 2023, pp. 1–40. EBSCOhost, https://doi.org/10.1002/adfm.202213744.

APA

Martins, P., Pereira, N., Lima, A. C., Garcia, A., Mendes, F. C., Policia, R., Correia, V., & Lanceros, M. S. (2023). Advances in Printing and Electronics: From Engagement to Commitment. Advanced Functional Materials, 33(16), 1–40. https://doi.org/10.1002/adfm.202213744

Chicago

Martins, P., N. Pereira, A. C. Lima, A. Garcia, Filipe, C. Mendes, R. Policia, V. Correia, and Mendez, S. Lanceros. 2023. “Advances in Printing and Electronics: From Engagement to Commitment.” Advanced Functional Materials 33 (16): 1–40. doi:10.1002/adfm.202213744.