Back to Search
Start Over
Simultaneously optimizing the strength and ductility of high-entropy alloys by magnetic field-assisted additive manufacturing.
- Source :
-
Journal of Alloys & Compounds . Jun2023, Vol. 947, pN.PAG-N.PAG. 1p. - Publication Year :
- 2023
-
Abstract
- The mechanical properties of many metallic materials have been optimized by magnetic field-assisted additive manufacturing, however, there is still a gap in high-entropy alloys (HEAs) in this field, which is not conducive to the control and optimization of the microstructure and properties of HEAs. This work studied the tensile properties of laser powder bed fusion (LPBF) CoCrFeMnNi HEA. After applying a magnetic field, the relative density increased, and the grain size became larger and more uniform. Because of amperage force, crystallographic textures gradually change from< 100 > to< 110 > and< 111 > , which contributes to the improvement of tensile properties. Additionally, low-angle grain boundaries and geometrically necessary dislocations decrease, while the Schmidt factor increases. In the results of these changes, most factors contribute to improving the mechanical property, eventually optimizing the strength and ductility simultaneously. This indicates that magnetic field-assisted LPBF is promising to be an important means to optimize the mechanical properties of HEAs. • The HEA prepared by magnetic field-assisted additive manufacturing was studied for the first time. • The existence of a magnetic field changes the microstructure of CoCrFeMnNi obviously. • Magnetic field-assisted additive manufacturing can improve both strength and ductility of CoCrFeMnNi. • <101>and<111>crystallographic textures of CoCrFeMnNi have better tensile property than<001>. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 09258388
- Volume :
- 947
- Database :
- Academic Search Index
- Journal :
- Journal of Alloys & Compounds
- Publication Type :
- Academic Journal
- Accession number :
- 162920513
- Full Text :
- https://doi.org/10.1016/j.jallcom.2023.169688