Cite
Dynamic warpage simulation of molded PCB under reflow process.
MLA
Edmund Sek, Chun Hei, et al. “Dynamic Warpage Simulation of Molded PCB under Reflow Process.” Circuit World, vol. 49, no. 2, Apr. 2023, pp. 202–10. EBSCOhost, https://doi.org/10.1108/CW-02-2021-0061.
APA
Edmund Sek, C. H., Abdullah, M. Z., Hwa Yu, K. H., & Wong, S. F. (2023). Dynamic warpage simulation of molded PCB under reflow process. Circuit World, 49(2), 202–210. https://doi.org/10.1108/CW-02-2021-0061
Chicago
Edmund Sek, Chun Hei, M.Z. Abdullah, Kok Hwa Hwa Yu, and Shaw Fong Wong. 2023. “Dynamic Warpage Simulation of Molded PCB under Reflow Process.” Circuit World 49 (2): 202–10. doi:10.1108/CW-02-2021-0061.