Cite
Effect of Surface Cleaning Process on the Wafer Bonding of Silicon and Pyrex Glass.
MLA
Du, Chao, et al. “Effect of Surface Cleaning Process on the Wafer Bonding of Silicon and Pyrex Glass.” Journal of Inorganic & Organometallic Polymers & Materials, vol. 33, no. 3, Mar. 2023, pp. 673–79. EBSCOhost, https://doi.org/10.1007/s10904-022-02510-x.
APA
Du, C., Zhao, Y., & Li, Y. (2023). Effect of Surface Cleaning Process on the Wafer Bonding of Silicon and Pyrex Glass. Journal of Inorganic & Organometallic Polymers & Materials, 33(3), 673–679. https://doi.org/10.1007/s10904-022-02510-x
Chicago
Du, Chao, Yali Zhao, and Yong Li. 2023. “Effect of Surface Cleaning Process on the Wafer Bonding of Silicon and Pyrex Glass.” Journal of Inorganic & Organometallic Polymers & Materials 33 (3): 673–79. doi:10.1007/s10904-022-02510-x.