Enhancing the interfacial binding strength between modular stretchable electronic components.

MLA

Ji, Shaobo, and Xiaodong Chen. “Enhancing the Interfacial Binding Strength between Modular Stretchable Electronic Components.” National Science Review, vol. 10, no. 1, Jan. 2023, pp. 1–19. EBSCOhost, https://doi.org/10.1093/nsr/nwac172.

APA

Ji, S., & Chen, X. (2023). Enhancing the interfacial binding strength between modular stretchable electronic components. National Science Review, 10(1), 1–19. https://doi.org/10.1093/nsr/nwac172

Chicago

Ji, Shaobo, and Xiaodong Chen. 2023. “Enhancing the Interfacial Binding Strength between Modular Stretchable Electronic Components.” National Science Review 10 (1): 1–19. doi:10.1093/nsr/nwac172.