Cite
Review of jet impingement cooling of electronic devices: Emerging role of surface engineering.
MLA
Sarkar, Sreya, et al. “Review of Jet Impingement Cooling of Electronic Devices: Emerging Role of Surface Engineering.” International Journal of Heat & Mass Transfer, vol. 206, June 2023, p. N.PAG. EBSCOhost, https://doi.org/10.1016/j.ijheatmasstransfer.2023.123888.
APA
Sarkar, S., Gupta, R., Roy, T., Ganguly, R., & Megaridis, C. M. (2023). Review of jet impingement cooling of electronic devices: Emerging role of surface engineering. International Journal of Heat & Mass Transfer, 206, N.PAG. https://doi.org/10.1016/j.ijheatmasstransfer.2023.123888
Chicago
Sarkar, Sreya, Rohit Gupta, Tamal Roy, Ranjan Ganguly, and Constantine M. Megaridis. 2023. “Review of Jet Impingement Cooling of Electronic Devices: Emerging Role of Surface Engineering.” International Journal of Heat & Mass Transfer 206 (June): N.PAG. doi:10.1016/j.ijheatmasstransfer.2023.123888.