PROCESSES FOR THINNING AND POLISHING HIGHLY WARPED DIE TO A NEARLY CONSISTENT THICKNESS: PART II.

MLA

Martin, Kirk A. “Processes for Thinning and Polishing Highly Warped Die to a Nearly Consistent Thickness: Part Ii.” Electronic Device Failure Analysis, vol. 25, no. 1, Feb. 2023, pp. 16–19. EBSCOhost, https://doi.org/10.31399/asm.edfa.2023-1.p016.

APA

Martin, K. A. (2023). Processes for Thinning and Polishing Highly Warped Die to a Nearly Consistent Thickness: Part Ii. Electronic Device Failure Analysis, 25(1), 16–19. https://doi.org/10.31399/asm.edfa.2023-1.p016

Chicago

Martin, Kirk A. 2023. “Processes for Thinning and Polishing Highly Warped Die to a Nearly Consistent Thickness: Part Ii.” Electronic Device Failure Analysis 25 (1): 16–19. doi:10.31399/asm.edfa.2023-1.p016.