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Hot deformation behavior and new grain size model of hot extruded FGH4096 superalloy during hot compression.

Authors :
Liu, Wei
Liu, Zhiling
Zhang, Hua
Ruan, Jingjing
Huang, Hailiang
Zhou, Xin
Meng, Fanchao
Zhang, Shangzhou
Jiang, Liang
Source :
Journal of Alloys & Compounds. Mar2023, Vol. 938, pN.PAG-N.PAG. 1p.
Publication Year :
2023

Abstract

The deformation behavior and grain size models of hot extruded (HEXed) FGH4096 superalloy at the temperature of 1040–1130 ℃ and the strain rate of 0.001–1 s−1 were investigated by hot compression. On the basis of the corrected flow stress curves, the constitutive equation considering the strain variable and hot working maps were established. The dynamic recrystallization (DRX) behaviors and microstructure evolution in different regions in hot working map superimposing the hot working instability maps were also analyzed. Discontinuous dynamic recrystallization (DDRX) occurs simultaneously with continuous dynamic recrystallization (CDRX) in the HEXed FGH4096 superalloy at low temperature, while only DDRX is activated at high deformation temperature. The wedge cracks, voids, and intergranular cracks are the main causes of flow instability. An optimal hot working window of deformation temperature = 1102–1130 ℃ and strain rate = 10−1.26–10−0 s−1 was obtained by combining the hot working maps and microstructure evolution. An established new grain size model by extending the Z parameter can predict the average grain size more accurately. • Constitutive equation and hot working maps are gained by friction-temperature corrected stresses. • An optimal working window is gained by combining hot working maps and microstructure. • Different DRX mechanisms dominate in different hot working regions. • A new grain size model is established by extending the Z parameter. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
09258388
Volume :
938
Database :
Academic Search Index
Journal :
Journal of Alloys & Compounds
Publication Type :
Academic Journal
Accession number :
161415782
Full Text :
https://doi.org/10.1016/j.jallcom.2022.168574