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Microstructure evolution and thermal, wetting, mechanical properties of SiC nanowires reinforced SAC105 composite solder.

Authors :
Lu, Xiao
Zhang, Liang
Guo, Yong-huan
Wang, Xi
Li, Mu-lan
chen, Chen
Gao, Li-Li
Zhao, Meng
Source :
Intermetallics. Mar2023, Vol. 154, pN.PAG-N.PAG. 1p.
Publication Year :
2023

Abstract

In this paper, SiC nanowires (NWs) were added to the SAC105 solder as an enhancement agent. By mechanical stirring, the Sn1.0Ag0.5Cu (SAC105)- x SiC (x = 0, 0.2, 0.4, 0.6, 0.8, 1.0 wt%) solders were prepared and served as samples to investigate the thermal properties, wettability, microstructure, interfacial microstructure, and mechanical properties. It was found that the addition of 0.4% SiC NWs allowed a substantial increase in the spreading area. The Cu 6 Sn 5 IMC and Ag 3 Sn IMC, and β-Sn grains were significantly refined within the SAC105-0.6SiC solder matrix. Meanwhile, the interfacial morphology became much flatter, and the thickness was minimized. Due to the refinement of Ag 3 Sn IMC and the reduction of the interfacial thickness, the mechanical properties of the composite solder were unsurprisingly improved. These were well demonstrated by the deeper and smaller dimples derived from the fracture surface. In addition, the mechanisms of microstructure refinement and enhancement of mechanical properties were revealed from the aspects of dispersion, adsorption, and pinning effect of SiC NWs. The deterioration of solder properties due to the agglomeration of SiC NWs was also well discussed. • The melting behavior, wettability, microstructure, and mechanical properties of SAC105-SiC(nanowires) solder were revealed. • The addition of 0.6 wt% SiC nanowires to SAC105 solder can significantly refine the microstructure and interfacial IMC. • The agglomerated SiC nanowires at the interface were found to seriously deteriorate the shear strength. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
09669795
Volume :
154
Database :
Academic Search Index
Journal :
Intermetallics
Publication Type :
Academic Journal
Accession number :
161400983
Full Text :
https://doi.org/10.1016/j.intermet.2022.107816