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Bonding and the role of electrostatics in driving C–C bond formation in high valent organocopper compounds.

Authors :
Shearer, Jason
Vasiliauskas, Dovydas
Lancaster, Kyle M.
Source :
Chemical Communications. 1/4/2023, Vol. 59 Issue 1, p98-101. 4p.
Publication Year :
2023

Abstract

The electronic structures and contrasting reactivity of [Cu(CF3)4]− and [Cu(CF3)3(CH3)]− were probed using coupled cluster and ab initio valence bond calculations. The Cu–C bonds in these complexes were found to be charge shift bonds. A key finding is that electrostatics likely prevent [Cu(CF3)4]− from accessing a productive transition state for C–C bond formation while promote one for [Cu(CF3)3(CH3)]−. These results therefore highlight essential design criteria for Cu-mediated C–C/C–heteroatom bond formation. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
13597345
Volume :
59
Issue :
1
Database :
Academic Search Index
Journal :
Chemical Communications
Publication Type :
Academic Journal
Accession number :
160930900
Full Text :
https://doi.org/10.1039/d2cc05865k