Back to Search
Start Over
Miniature and Symmetrical Transformer Based on Through-Silicon Vias.
- Source :
-
IEEE Transactions on Components, Packaging & Manufacturing Technology . Oct2022, Vol. 12 Issue 10, p1645-1652. 8p. - Publication Year :
- 2022
-
Abstract
- A high-density symmetrical transformer based on through-silicon via (TSV) is proposed in this article. The primary winding and secondary winding have strong symmetry, and the inductance mismatch is less than 0.1%, so the transformer structure is suitable for differential circuit. Compared with transformers in other literatures, the proposed transformer has advantages in area and efficiency, which is reflected in that the on-chip area is greatly reduced by 58% to 89%, and the coupling coefficient can reach more than 0.92. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 21563950
- Volume :
- 12
- Issue :
- 10
- Database :
- Academic Search Index
- Journal :
- IEEE Transactions on Components, Packaging & Manufacturing Technology
- Publication Type :
- Academic Journal
- Accession number :
- 160689950
- Full Text :
- https://doi.org/10.1109/TCPMT.2022.3209826