Realizing high-strength diffusion bonding of copper at ultra-low temperatures via single point diamond turning and spark plasma sintering.

Single point diamond turning (SPDT) could produce nanoscale surface roughness and surface nanograins. When subsequently heated by spark plasma sintering (SPS), the SPDT processed copper realized diffusion bonding at an ultra-low temperature of ∼202 °C (0.35 T m). Finally, high-strength (∼269 MPa) diffusion bonding of copper was achieved via SPDT and SPS. [ABSTRACT FROM AUTHOR]