Room-temperature direct bonding of ZrO2 ceramic and SiCP/Al composite using ultrasonic waves.

Direct bonding of ZrO 2 ceramic and SiC P /2A14 composite was successfully achieved in only a few seconds using ultrasonic waves at room temperature. A continuous void-free amorphous Al 2 O 3 interphase layer with an average thickness ranging from 60 to 70 nm was verified to be formed between ZrO 2 ceramic and SiC P /2A14 composite, which could be attributed to the significantly enhanced diffusion of O and Al atoms around the bonding interface due to a remarkable increase in defect density caused by the physical effects of ultrasonic vibration. The maximum average shear strength of the ZrO 2 –SiC P /2A14 joints was approximately 36.48 MPa. [ABSTRACT FROM AUTHOR]