Short-Duration Transient Temperature Distribution Prediction Model along Chip Vertical Path Applicable to Multi-Timescale Simulation.

MLA

Han, Tongyao, et al. “Short-Duration Transient Temperature Distribution Prediction Model along Chip Vertical Path Applicable to Multi-Timescale Simulation.” Energies (19961073), vol. 15, no. 19, Oct. 2022, p. 7393. EBSCOhost, https://doi.org/10.3390/en15197393.

APA

Han, T., Luo, Y., Liu, B., Ma, X., & Xie, F. (2022). Short-Duration Transient Temperature Distribution Prediction Model along Chip Vertical Path Applicable to Multi-Timescale Simulation. Energies (19961073), 15(19), 7393. https://doi.org/10.3390/en15197393

Chicago

Han, Tongyao, Yifei Luo, Binli Liu, Xiao Ma, and Feng Xie. 2022. “Short-Duration Transient Temperature Distribution Prediction Model along Chip Vertical Path Applicable to Multi-Timescale Simulation.” Energies (19961073) 15 (19): 7393. doi:10.3390/en15197393.