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Direct light-driven electrodeposition of Bi and Cu without external voltage: Light-induced metal recovery and energy conversion.

Authors :
Li, Yuewen
Zhang, Yu
Hou, Xing
Lin, Chunkun
Bu, Degang
Lan, Yalin
Li, Na
Wu, Shuyao
Li, Shuo
Song, Xi-Ming
Source :
Materials Science in Semiconductor Processing. Dec2022, Vol. 152, pN.PAG-N.PAG. 1p.
Publication Year :
2022

Abstract

Seeking novel solar energy utilization and conversion methods has always been a frontier topic in energy research. Here, we propose a new way to directly photoelectrodeposit metals using solar energy based on semiconductor energy band theory. Three kinds of semiconductor photoanodes (TiO 2 , BiVO 4 and Fe 2 O 3) are employed to deposit metallic Cu or Bi at the cathode under illumination without external voltage. It is found that when TiO 2 and BiVO 4 are used as photoanodes, Cu, Cu 2 O and Bi can be continuously deposited on the cathode, but when Fe 2 O 3 photoanode is irradiated, no material comes out. The results prove that the potential of electrons in the conduction band determines whether photoelectric deposition occurs or not. The related mechanism involves the oxygen reduction reaction (OER) of the valence band holes of the photoanode, the collection of conduction band electrons by back electrode, as well as the reduction of metal ions on the counter electrode. In addition, we also put forward the concept of using the deposited Cu or Bi as the metal electrode to form a new metal-air battery to release chemical energy of the deposited metal. [Display omitted] • Cu and Bi are directly deposited by a photoelectrochemical cell without bias. • The charge transfer mechanism of photoelectric deposition metals is studied. • A new type of Cu/Bi-air battery is proposed. • A new energy conversion system is built. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
13698001
Volume :
152
Database :
Academic Search Index
Journal :
Materials Science in Semiconductor Processing
Publication Type :
Academic Journal
Accession number :
159476620
Full Text :
https://doi.org/10.1016/j.mssp.2022.107083