Wettability control of paper through substitution between the hydroxyl group and carbon elements using argon-carbon plasma treatment.

The surface of paper was treated to control wettability using argon-carbon plasma generated by a direct current-pulsed (frequency: 60 kHz) sputtering device with parallel-arrangement magnets. After plasma treatment, the C–C bond percentage in the C 1s region was inversely proportional to the C–OH bond percentage, while the ratio of C=O and O–C=O bonds only changed slightly. The change ratios for the increase in C–C and the decrease in the C–OH bonds were approximately the same, and the change ratio increased from approximately 5%–11% with an increase in the plasma current. The reduction ratio of the contact angle decreased from 0.945 to 0.182 (°/s) with increasing plasma current. These results indicate that the water resistance of the paper surface was enhanced after the simple plasma treatment, and wettability could be easily controlled by changing the substitution ratio between C–OH and C–C elements, achieved by altering the plasma current. • Papers were plasma-treated using DC-pulsed sputtering with parallel-aligned magnets. • C–C and C–OH bond percentages were inversely proportional after plasma treatment. • Substitution ratio between C–OH and C–C was changed by varying the plasma current. • Contact angle reduction ratio on paper decreased with increase in plasma current. [ABSTRACT FROM AUTHOR]